Ingrid De Wolf

Publication Activity (10 Years)

Years Active: 2001-2024
Publications (10 Years): 36

Top Topics

Solder Ball Connect

Integrated Circuit

Top Venues

Microelectron. Reliab.

Microelectron. J.

Publications

Pietro Rinaudo, Adrian Vaisman Chasin, Ying Zhao, Ben Kaczer, Nouredine Rassoul, Harold Dekkers, Michiel J. van Setten, Attilio Belmonte, Ingrid De Wolf, Gouri Sankar Kar, Jacopo Franco
Light-Assisted Investigation of the Role of Oxygen Flow during IGZO Deposition on Deep Subgap States and their Evolution Under PBTI. IRPS (2024)
Ping-Yi Hsieh, Ameni Ben Driss, Artemisia Tsiara, Barry J. O'Sullivan, Didit Yudistira, Bernardette Kunert, Joris Van Campenhout, Ingrid De Wolf
Modeling Dark Current Degradation of Monolithic InGaAs/GaAs-On-Si Nano-Ridge Photodetectors. IRPS (2024)
Y. Fang, Alicja Lesniewska, Ivan Ciofi, Philippe Roussel, Chen Wu, Victor Vega-Gonzalez, Ingrid De Wolf, Kris Croes
BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure. IRPS (2024)
Ying Zhao, Pietro Rinaudo, Adrian Vaisman Chasin, Brecht Truijen, Ben Kaczer, Nouredine Rassoul, Harold Dekkers, Attilio Belmonte, Ingrid De Wolf, Gouri Sankar Kar, Jacopo Franco
Fundamental understanding of NBTI degradation mechanism in IGZO channel devices. IRPS (2024)
Andrea Vici, Robin Degraeve, Naoto Horiguchi, Ingrid De Wolf, Jacopo Franco
SILC and TDDB reliability of novel low thermal budget RMG gate stacks. IRPS (2024)
David Coenen, Minkyu Kim, Herman Oprins, Ingrid De Wolf, Yoojin Ban, Joris Van Campenhout
Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator. PSC (2023)
A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes
Impact of via geometry and line extension on via-electromigration in nano-interconnects. IRPS (2023)
Andrea Vici, Robin Degraeve, Philippe J. Roussel, Jacopo Franco, Ben Kaczer, Ingrid De Wolf
Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations. IRPS (2023)
David Coenen, Herman Oprins, Robin Degraeve, Ingrid De Wolf
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (7) (2023)
Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS (2023)
Ping-Yi Hsieh, Artemisia Tsiara, Barry J. O'Sullivan, Didit Yudistira, Marina Baryshnikova, Guido Groeseneken, Bernardette Kunert, Marianna Pantouvaki, Joris Van Campenhout, Ingrid De Wolf
Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon. IRPS (2022)
Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf
Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress. IRPS (2022)
Andrea Vici, Robin Degraeve, João Pedro Bastos, Philippe Roussel, Ingrid De Wolf
Combining SILC and BD statistics for low-voltage lifetime projection in HK/MG stacks. IRPS (2022)
Anastasiia Kruv, Sean R. C. McMitchell, Sergiu Clima, Oguzhan O. Okudur, Nicolo Ronchi, Geert Van den Bosch, Mario Gonzalez, Ingrid De Wolf, Jan Van Houdt
Impact of mechanical strain on wakeup of HfO2 ferroelectric memory. IRPS (2021)
Michael Kögel, Sebastian Brand, Christian Große, Kristof J. P. Jacobs, Ingrid De Wolf, Frank Altmann
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR). CASE (2021)
Anastasiia Kruv, Ben Kaczer, Alexander Grill, Mario Gonzalez, Jacopo Franco, Dimitri Linten, Wolfgang Gös, Tibor Grasser, Ingrid De Wolf
On the impact of mechanical stress on gate oxide trapping. IRPS (2020)
Yefan Liu, Hao Yu, Gaspard Hiblot, Anastasiia Kruv, Marc Schaekers, Naoto Horiguchi, Dimitrios Velenis, Ingrid De Wolf
Study of the Mechanical Stress Impact on Silicide Contact Resistance by 4-Point Bending. IRPS (2019)
Anastasiia Kruv, Antonio Arreghini, Mario Gonzalez, Devin Verreck, Geert Van den Bosch, Ingrid De Wolf, A. Furnémont
Impact of Mechanical Stress on the Electrical Performance of 3D NAND. IRPS (2019)
Norbert Herfurth, Anne Beyreuther, Elham Amini, Christian Boit, Michél Simon-Najasek, Susanne Hübner, Frank Altmann, R. Herfurth, Chen Wu, Ingrid De Wolf, Kris Croes
New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis. IRPS (2019)
Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tokei, Kristof Croes
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS (2019)
Ivo Vogt, Tomonori Nakamura, Ingrid De Wolf, Christian Boit
Detection of failure mechanisms in 24-40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera. Microelectron. Reliab. (2018)
Anne Beyreuther, Norbert Herfurth, Elham Amini, Tomonori Nakamura, Ingrid De Wolf, Christian Boit
Photon emission as a characterization tool for bipolar parasitics in FinFET technology. Microelectron. Reliab. (2018)
Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tokei, Eric Beyne
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS (2018)
Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf
Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. IRPS (2018)
Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tokei, Kristof Croes
The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS (2018)
Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. Microelectron. Reliab. (2017)
Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tokei
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79 (2017)
A. Khaled, Luka Kljucar, Sebastian Brand, Michael Kögel, R. Aertgeerts, R. Nicasy, Ingrid De Wolf
Study of GHz-SAM sensitivity to delamination in BEOL layers. Microelectron. Reliab. (2017)
Deniz Kocaay, Philippe Roussel, Kris Croes, Ivan Ciofi, Y. Saad, Ingrid De Wolf
LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration. Microelectron. Reliab. (2017)
A. Khaled, Sebastian Brand, Michael Kögel, T. Appenroth, Ingrid De Wolf
Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis. Microelectron. Reliab. 64 (2016)
Vice Sodan, Federica Lidia Teresa Maggioni, Herman Oprins, Steve Stoffels, Martine Baelmans, Ingrid De Wolf
New fast distributed thermal model for analysis of GaN based power devices. ESSDERC (2016)
Aidan Cowley, Andrej Ivankovic, C. S. Wong, N. S. Bennett, A. N. Danilewsky, Marcel Gonzalez, Vladimir Cherman, Bart Vandevelde, Ingrid De Wolf, P. J. McNally
B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages. Microelectron. Reliab. 59 (2016)
Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tokei
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. 56 (2016)
M. Herms, M. Wagner, Ingrid De Wolf
Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy. Microelectron. Reliab. 64 (2016)
S. A. Srinivasan, Peter Verheyen, R. Loo, Ingrid De Wolf, Marianna Pantouvaki, Guy Lepage, S. Balakrishnan, W. Vanherle, Philippe Absil, Joris Van Campenhout
50Gb/s C-band GeSi waveguide electro-absorption modulator. OFC (2016)
Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne
Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test 33 (3) (2016)
A. Rouhi Najaf Abadi, W. Guo, X. Sun, K. Ben Ali, Jean-Pierre Raskin, M. Rack, C. Roda Neve, M. Choi, V. Moroz, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Philippe P. Absil
Through silicon via to FinFET noise coupling in 3-D integrated circuits. ICICDT (2015)
Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tokei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen
Constant voltage electromigration for advanced BEOL copper interconnects. IRPS (2015)
Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. Microelectron. Reliab. 55 (5) (2015)
Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS (2015)
Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54 (6-7) (2014)
Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectron. Reliab. 54 (9-10) (2014)
Baojun Tang, Kris Croes, Y. Barbarin, Y. Q. Wang, Robin Degraeve, Y. Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tokei, Ingrid De Wolf
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. Microelectron. Reliab. 54 (9-10) (2014)
F. L. T. Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans
Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact. Microelectron. J. 45 (12) (2014)
George Vakanas, Björn Vandecasteele, David Schaubroeck, Joke De Messemaeker, Geert Willems, Mark Ashworth, Geoffrey D. Wilcox, Ingrid De Wolf
Sn whisker evaluations in 3D microbumped structures. Microelectron. Reliab. 54 (9-10) (2014)
B. Wang, Jeroen De Coster, Martine Wevers, Ingrid De Wolf
A novel method to measure the internal pressure of MEMS thin-film packages. Microelectron. Reliab. 53 (9-11) (2013)
Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf
Sn phase in the bump and thin film Cu/Sn structures. Microelectron. Reliab. 52 (9-10) (2012)
H. A. C. Tilmans, Jeroen De Coster, P. Helin, Vladimir Cherman, A. Jourdain, P. De Moor, Bart Vandevelde, N. P. Pham, J. Zekry, Ann Witvrouw, Ingrid De Wolf
MEMS packaging and reliability: An undividable couple. Microelectron. Reliab. 52 (9-10) (2012)
Ahmad Khaled, Moatassim Raoof, Vladimir Cherman, Karoline Jans, Mohammad Abbas, Shaker Ebrahim, Goerge Bryce, Peter Verheyen, Ann Witvrouw, Ingrid De Wolf
Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing. Microelectron. Reliab. 52 (9-10) (2012)
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT (2012)
Fangzhou Ling, Jeroen De Coster, Ann Witvrouw, Jean-Pierre Celis, Ingrid De Wolf
Study of glass frit induced stiction using a micromirror array. Microelectron. Reliab. 52 (9-10) (2012)
Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne
Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectron. Reliab. 51 (9-11) (2011)
Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson
Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. Microelectron. Reliab. 51 (9-11) (2011)
Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46 (1) (2011)
Rui Liu, Dominique M. M.-P. Schreurs, Walter De Raedt, Frederik Vanaverbeke, Robert P. Mertens, Ingrid De Wolf
Thermal optimization of GaN-on-Si HEMTs with plastic package. Microelectron. Reliab. 51 (9-11) (2011)
Bo Wang, Shuji Tanaka, B. Guo, G. Vereecke, Simone Severi, Ann Witvrouw, Martine Wevers, Ingrid De Wolf
Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. Microelectron. Reliab. 51 (9-11) (2011)
Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, W. Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC (2011)
Rui Liu, Dominique M. M.-P. Schreurs, Walter De Raedt, Frederik Vanaverbeke, J. Das, Robert P. Mertens, Ingrid De Wolf
Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology. Microelectron. Reliab. 51 (9-11) (2011)
Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne
In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC (2011)
Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. Microelectron. Reliab. 50 (9-11) (2010)
Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal
3D integration: Circuit design, test, and reliability challenges. IOLTS (2010)
Sandeep Sangameswaran, Jeroen De Coster, Guido Groeseneken, Ingrid De Wolf
Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors. Microelectron. Reliab. 50 (9-11) (2010)
Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC (2010)
Guido Groeseneken, Ingrid De Wolf, A. J. Mouthaan, Jaap Bisschop
Editorial. Microelectron. Reliab. 48 (8-9) (2008)
Stanislaw Kalicinski, Martine Wevers, Ingrid De Wolf
Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency. Microelectron. Reliab. 48 (8-9) (2008)
Yu Yang, Hugo Bender, Kai Arstila, Bart Swinnen, Bert Verlinden, Ingrid De Wolf
Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures. Microelectron. Reliab. 48 (8-9) (2008)
Robert Modlinski, Ann Witvrouw, Petar Ratchev, A. Jourdain, Veerle Simons, H. A. C. Tilmans, Jaap M. J. den Toonder, Robert Puers, Ingrid De Wolf
Creep as a reliability problem in MEMS. Microelectron. Reliab. 44 (9-11) (2004)
Ingrid De Wolf
MEMS reliability. Microelectron. Reliab. 43 (7) (2003)
Ingrid De Wolf, W. Merlijn van Spengen
Techniques to study the reliability of metal RF MEMS capacitive switches. Microelectron. Reliab. 42 (9-11) (2002)
Kai F. Dombrowski, B. Dietrich, Ingrid De Wolf, R. Rooyackers, G. Badenes
Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy. Microelectron. Reliab. 41 (4) (2001)
Ingrid De Wolf, Mahmoud Rasras
Spectroscopic photon emission microscopy: a unique tool for failure analysis of microelectronics devices. Microelectron. Reliab. 41 (8) (2001)