Mikael Detalle

Publication Activity (10 Years)

Years Active: 2011-2016
Publications (10 Years): 1

Top Topics

Comparative Study

Magnetic Recording

Top Venues

Publications

C. Roda Neve, Mikael Detalle, Philip Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. 3DIC (2016)
Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne
Processing active devices on Si interposer and impact on cost. 3DIC (2015)
Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean
Active-lite interposer for 2.5 & 3D integration. VLSIC (2015)
X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne
Analysis of 3D interconnect performance: Effect of the Si substrate resistivity. 3DIC (2014)
Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. 3DIC (2014)
Dimitrios Velenis, Mikael Detalle, Erik Jan Marinissen, Eric Beyne
Si interposer build-up options and impact on 3D system cost. 3DIC (2013)
Jaemin Kim, Sunyoung Kim, Julien Ryckaert, Mikael Detalle, Nele Van Hoovels, Pol Marchal
A calibrated pathfinding model for signal integrity analysis on interposer. CICC (2012)
Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, W. Zhang, Eric Beyne
3D stacking using ultra thin dies. 3DIC (2011)
Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, W. Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC (2011)