Joeri De Vos

Publication Activity (10 Years)

Years Active: 2014-2019
Publications (10 Years): 8

Top Topics

Comparative Study

Cmos Image Sensor

Top Venues

IEICE Electron. Express

Microelectron. Reliab.

Publications

Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC (2019)
Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. 3DIC (2019)
Yuuki Araga, Makoto Nagata, Joeri De Vos, Geert Van der Plas, Eric Beyne
A study on substrate noise coupling among TSVs in 3D chip stack. IEICE Electron. Express 15 (13) (2018)
Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tokei
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79 (2017)
Stefaan Van Huylenbroeck, Yunlong Li, Michele Stucchi, Lieve Bogaerts, Joeri De Vos, Gerald Beyer, Eric Beyne, Mohand Brouri, Praveen Nalla, Sanjay Gopinath, Matthew Thorum, Joe Richardson, Jengyi Yu
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. 3DIC (2016)
C. Roda Neve, Mikael Detalle, Philip Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. 3DIC (2016)
Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 3DIC (2016)
Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas
Extreme wafer thinning optimization for via-last applications. 3DIC (2016)
Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne
Thermal experimental and modeling analysis of high power 3D packages. ICICDT (2015)
Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. 3DIC (2014)