Microelectron. Reliab.

Keyphrases

Publications

volume 91, 2018

Sean P. Ogden, Yueming Xu, Kong Boon Yeap, Tian Shen, Toh-Ming Lu, Joel L. Plawsky
Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. Microelectron. Reliab. 91 (2018)
Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Guisheng Zou, Lei Liu
Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application. Microelectron. Reliab. 91 (2018)
P. Rajendiran, R. Srinivasan
Heavy ion impact on narrow band cascoded low noise amplifier. Microelectron. Reliab. 91 (2018)
Joyeeta Basu, Nirmalya Samanta, Sukhendu Jana, Chirasree RoyChaudhuri
Towards reliability enhancement of graphene FET biosensor in complex analyte: Artificial neural network approach. Microelectron. Reliab. 91 (2018)
Indudhar Panduranga Vali, Pramoda Kumara Shetty, M. G. Mahesha, V. C. Petwal, Jishnu Dwivedi, D. M. Phase, R. J. Choudhary
Implications of electron beam irradiation on Al/n-Si Schottky junction properties. Microelectron. Reliab. 91 (2018)
Dei-Wei Chou, Kuan-Lin Chen, Shih-Feng Wang
Pentacene bottom-contact thin film transistors with solution-processed BZT gate dielectrics. Microelectron. Reliab. 91 (2018)
Byung-seung Yim, Young-Eui Shin, Jong-Min Kim
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs). Microelectron. Reliab. 91 (2018)
Fei Yu, Chuanzhong Xu, Gongyi Huang, Wei Lin, Tsair-Chun Liang
A closed-form trapped-charge-included drain current compact model for amorphous oxide semiconductor thin-film transistors. Microelectron. Reliab. 91 (2018)
Hsin-Kai Fang, Kuei-Shu Chang-Liao, Chia-Hsin Cheng, Po-Yao Lin, Wen-Hsien Huang, Chang-Hong Shen, Jia-Min Shieh
trapping layers formed with low temperature processes on gate-all-around junctionless charge-trapping flash memory devices. Microelectron. Reliab. 91 (2018)
Zheng Zhao, Ningyue Jiang, Zhenqiang Ma, Guoxuan Qin
Impact of finger numbers on the performance of proton-radiated SiGe power HBTs at room and cryogenic temperatures. Microelectron. Reliab. 91 (2018)
Frank Kraemer, Mike Roellig, René Metasch, Joseph Al Ahmar, Karsten Meier, Steffen Wiese
Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. Microelectron. Reliab. 91 (2018)
Ana Cóbreces, Alberto Regadío, Jesús Tabero, Pedro Reviriego, Alfonso Sánchez-Macián, Juan Antonio Maestro
Seu and Sefi error detection and correction on a ddr3 memory system. Microelectron. Reliab. 91 (2018)
Cuicui Hang, Liming Ying, Naiqiu Shu
Transistor open-circuit fault diagnosis in two-level three-phase inverter based on similarity measurement. Microelectron. Reliab. 91 (2018)
Shalu Kaundal, Ashwani K. Rana
Evaluation of statistical variability and parametric sensitivity of non-uniformly doped Junctionless FinFET. Microelectron. Reliab. 91 (2018)
Chin-Yi Tsai
A theoretical model for calculating the effects of carrier heating with nonequilibrium hot phonons on semiconductor devices and the current-voltage relations. Microelectron. Reliab. 91 (2018)
Mohamed Ali Belaïd
Performance analysis of S-parameter in N-MOSFET devices after thermal accelerated tests. Microelectron. Reliab. 91 (2018)
Ali Ahari, Alexander Viehl, Oliver Bringmann, Wolfgang Rosenstiel
Mission profile-based assessment of semiconductor technologies for automotive applications. Microelectron. Reliab. 91 (2018)
T. H. Nouibat, Zitouni Messai, D. Chikouch, Z. Ouennoughi, N. Rouag, Mathias Rommel, Lothar Frey
Normalized differential conductance to study current conduction mechanisms in MOS structures. Microelectron. Reliab. 91 (2018)
Hyun-Woong Park, Sang-Jun Lee, Dong-Chul Cho, Sang-Hoon Lee, Jae-Kyun Kim, Jun-Hee Lee, Sang-Kyo Jung, Hong-Sik Nam, Patrick Hsu, Shin Low, Sung-Hwan Lim
Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire. Microelectron. Reliab. 91 (2018)
Jizuo Zhang, Jianjun Chen, Pengcheng Huang, Shouping Li, Liang Fang
Angular dependency on heavy-ion-induced single-event multiple transients (SEMT) in 65 nm twin-well and triple-well CMOS technology. Microelectron. Reliab. 91 (2018)
Hamed Kamrani, Feng Yu, Kristian Frank, Klaas Strempel, Muhammad Fahlesa Fatahilah, Hutomo Suryo Wasisto, Friedhard Römer, Andreas Waag, Bernd Witzigmann
Thermal performance analysis of GaN nanowire and fin-shaped power transistors based on self-consistent electrothermal simulations. Microelectron. Reliab. 91 (2018)
Jiaxing Hu, Bo Jing, Zengjin Sheng, Fang Lu, Yaojun Chen, Yulin Zhang
Failure and failure characterization of QFP package interconnect structure under random vibration condition. Microelectron. Reliab. 91 (2018)
Qi Zhang, Yuping Wu, Lan Chen, Xuelian Zhang
A robust asynchronous 16 × 16-bit subthreshold multiplier using SAPTL technique. Microelectron. Reliab. 91 (2018)
Mengtian Bao, Ying Wang, Xingji Li, Chaoming Liu, Cheng-Hao Yu, Fei Cao
Simulation study of single event effects in the SiC LDMOS with a step compound drift region. Microelectron. Reliab. 91 (2018)
Bruno R. Mose, In-Seo Son, Dong-Kil Shin
Adhesion strength of die attach film for thin electronic package at elevated temperature. Microelectron. Reliab. 91 (2018)
Ze Zhu, Yan-Cheong Chan, Fengshun Wu
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing. Microelectron. Reliab. 91 (2018)
Siavash Es'haghi, Mohammad Eshghi
Lifetime-aware scheduling in high level synthesis. Microelectron. Reliab. 91 (2018)
Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. Microelectron. Reliab. 91 (2018)
Zheng-Yuan Wu, Shiang-Feng Tang, Hong-Yuan Zeng, Wen-Jen Lin, Tzu-Chiang Chen, Yau-Tang Gau
/reduced graphene oxide (rGO) composite microbolometer. Microelectron. Reliab. 91 (2018)
Krzysztof Górecki, Przemyslaw Ptak
New dynamic electro-thermo-optical model of power LEDs. Microelectron. Reliab. 91 (2018)
Karkulali Pugalenthi, Nagarajan Raghavan
A holistic comparison of the different resampling algorithms for particle filter based prognosis using lithium ion batteries as a case study. Microelectron. Reliab. 91 (2018)
Xuerong Ye, Kaixin Zhang, Cen Chen, Zhongwei Li, Yue Wang, Guofu Zhai
The threshold voltage degradation model of N Channel VDMOSFETs under PBT stress. Microelectron. Reliab. 91 (2018)
Kuan-Wei Lee, Chuan-Hsi Liu, Durga Misra
Wide Bandgap Materials for Semiconductor Devices. Microelectron. Reliab. 91 (2018)
Lorenzo Codecasa, Márta Rencz
To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'17. Microelectron. Reliab. 91 (2018)
Ligang Tan, Ziwen Li, Yunxiu Xiang, Pengfei Feng, Yage Guo
A critical analysis of the bulk current injection immunity test based on common-mode and differential-mode. Microelectron. Reliab. 91 (2018)
Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi
Analytical model for the transient analysis of electronic assemblies subjected to impact loading. Microelectron. Reliab. 91 (2018)
Marta Kuczynska, Natalja Schafet, Ulrich Becker, René Metasch, Mike Roellig, Alexander Kabakchiev, Stefan Weihe
Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load. Microelectron. Reliab. 91 (2018)
Mariusz Zubert, Tomasz Raszkowski, Agnieszka Samson, Piotr Zajac
Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs. Microelectron. Reliab. 91 (2018)
Kosala Yapabandara, Vahid Mirkhani, Shiqiang Wang, Min P. Khanal, Sunil Uprety, Tamara Isaacs-Smith, Michael C. Hamilton, Minseo Park
Proton-induced displacement damage in ZnO thin film transistors: Impact of damage location. Microelectron. Reliab. 91 (2018)
Te-Jen Su, Yi-Feng Chen, Jui-Chuan Cheng, Chien-Liang Chiu
An artificial neural network approach for wafer dicing saw quality prediction. Microelectron. Reliab. 91 (2018)
Kai-Huang Chen, Chien-Min Cheng, Cheng-Ying Li, Shou-Jen Huang
Hopping conduction distance of bipolar switching GdOx resistance random access memory thin films devices modified by different constant compliance current. Microelectron. Reliab. 91 (2018)
Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectron. Reliab. 91 (2018)
Zhizhan Yang, Xiaodong Xie, Xue Fan, Yubo Ren
A novel single-event-hardened charge pump using cascode voltage switch logic gates. Microelectron. Reliab. 91 (2018)
Jian-Chiun Liou, Cheng-Fu Yang
Investigation of DNA sequencing droplet trajectory observation and analysis. Microelectron. Reliab. 91 (2018)

volume 87, 2018