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Byung-seung Yim
ORCID
Publication Activity (10 Years)
Years Active: 2011-2018
Publications (10 Years): 2
Top Topics
Mechanical Properties
Highly Correlated
Reliability Analysis
Carbon Dioxide
Top Venues
Microelectron. Reliab.
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Publications
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Byung-seung Yim
,
Young-Eui Shin
,
Jong-Min Kim
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs).
Microelectron. Reliab.
91 (2018)
Byung-seung Yim
,
Jong-Min Kim
Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive.
Microelectron. Reliab.
57 (2016)
Byung-seung Yim
,
Jeong-Il Lee
,
Byung-Hun Lee
,
Young-Eui Shin
,
Jong-Min Kim
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler.
Microelectron. Reliab.
54 (12) (2014)
Jiwon Kim
,
Byung-seung Yim
,
Jongmin Kim
,
Jooheon Kim
The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs).
Microelectron. Reliab.
52 (3) (2012)
Byung-seung Yim
,
Yumi Kwon
,
Seung Hoon Oh
,
Jooheon Kim
,
Yong-Eui Shin
,
Seong Hyuk Lee
,
Jongmin Kim
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging.
Microelectron. Reliab.
52 (6) (2012)
Yumi Kwon
,
Byung-seung Yim
,
Jongmin Kim
,
Jooheon Kim
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant.
Microelectron. Reliab.
51 (4) (2011)
Yumi Kwon
,
Byung-seung Yim
,
Jongmin Kim
,
Jooheon Kim
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs).
Microelectron. Reliab.
51 (4) (2011)