Young-Eui Shin

Publication Activity (10 Years)

Years Active: 2014-2018
Publications (10 Years): 1

Top Topics

Mechanical Design

Highly Correlated

Reliability Analysis

Signal Processing

Top Venues

Microelectron. Reliab.

Publications

Byung-seung Yim, Young-Eui Shin, Jong-Min Kim
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs). Microelectron. Reliab. 91 (2018)
Byung-seung Yim, Jeong-Il Lee, Byung-Hun Lee, Young-Eui Shin, Jong-Min Kim
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler. Microelectron. Reliab. 54 (12) (2014)