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An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler.
Byung-seung Yim
Jeong-Il Lee
Byung-Hun Lee
Young-Eui Shin
Jong-Min Kim
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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independent component analysis
signal processing
face recognition
databases
information systems
feature extraction
reliability analysis
real time
social networks
preprocessing
principal components
highly correlated
high levels
single point
highly reliable
reliability assessment