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Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging.

Byung-seung YimYumi KwonSeung Hoon OhJooheon KimYong-Eui ShinSeong Hyuk LeeJongmin Kim
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • embodied conversational agents
  • climbing robot
  • high speed
  • high density
  • real time
  • human computer interaction