Login / Signup
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging.
Byung-seung Yim
Yumi Kwon
Seung Hoon Oh
Jooheon Kim
Yong-Eui Shin
Seong Hyuk Lee
Jongmin Kim
Published in:
Microelectron. Reliab. (2012)
Keyphrases
</>
embodied conversational agents
climbing robot
high speed
high density
real time
human computer interaction