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Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire.

Hyun-Woong ParkSang-Jun LeeDong-Chul ChoSang-Hoon LeeJae-Kyun KimJun-Hee LeeSang-Kyo JungHong-Sik NamPatrick HsuShin LowSung-Hwan Lim
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • wire bonding
  • bond pad
  • stress response
  • dynamic behavior
  • genetic algorithm
  • information systems
  • decision making
  • e learning
  • data structure
  • human behavior
  • facial expression recognition
  • cognitive style
  • heat transfer