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Sung-Hwan Lim
Publication Activity (10 Years)
Years Active: 2011-2018
Publications (10 Years): 2
Top Topics
Wire Bonding
Bond Pad
Stress Response
Heat Transfer
Top Venues
Microelectron. Reliab.
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Publications
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Hyun-Woong Park
,
Sang-Jun Lee
,
Dong-Chul Cho
,
Sang-Hoon Lee
,
Jae-Kyun Kim
,
Jun-Hee Lee
,
Sang-Kyo Jung
,
Hong-Sik Nam
,
Patrick Hsu
,
Shin Low
,
Sung-Hwan Lim
Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire.
Microelectron. Reliab.
91 (2018)
Mi-Ri Choi
,
Hyung-Giun Kim
,
Taeg-Woo Lee
,
Young-Jun Jeon
,
Yong-Keun Ahn
,
Kyo-Wang Koo
,
You-Cheol Jang
,
So-Yeon Park
,
Jae-Hak Yee
,
Nam-Kwon Cho
,
Il-Tae Kang
,
Sangshik Kim
,
Seung-Zeon Han
,
Sung-Hwan Lim
Microstructural evaluation and failure analysis of Ag wire bonded to Al pads.
Microelectron. Reliab.
55 (11) (2015)
Hyung-Giun Kim
,
Taeg-Woo Lee
,
Eun-Kyun Jeong
,
Won-Yong Kim
,
Sung-Hwan Lim
Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire.
Microelectron. Reliab.
51 (12) (2011)