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Microstructural evaluation and failure analysis of Ag wire bonded to Al pads.

Mi-Ri ChoiHyung-Giun KimTaeg-Woo LeeYoung-Jun JeonYong-Keun AhnKyo-Wang KooYou-Cheol JangSo-Yeon ParkJae-Hak YeeNam-Kwon ChoIl-Tae KangSangshik KimSeung-Zeon HanSung-Hwan Lim
Published in: Microelectron. Reliab. (2015)
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