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Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire.
Hyung-Giun Kim
Taeg-Woo Lee
Eun-Kyun Jeong
Won-Yong Kim
Sung-Hwan Lim
Published in:
Microelectron. Reliab. (2011)
Keyphrases
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thermal conductivity
desirable properties
real world
structural properties
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