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Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing.

Ze ZhuYan-Cheong ChanFengshun Wu
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • data sets
  • real time
  • genetic algorithm
  • artificial intelligence
  • case study
  • bayesian networks
  • computational models