Fengshun Wu

Publication Activity (10 Years)

Years Active: 2015-2018
Publications (10 Years): 1

Top Topics

Mechanical Properties

Bayesian Networks

Business Intelligence

Top Venues

Microelectron. Reliab.

Publications

Ze Zhu, Yan-Cheong Chan, Fengshun Wu
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing. Microelectron. Reliab. 91 (2018)
Tianwei Hu, Yi Li, Yan-Cheong Chan, Fengshun Wu
particles doping on electromigration and mechanical properties of Sn-58Bi solder joints. Microelectron. Reliab. 55 (8) (2015)