Seungbae Park

Publication Activity (10 Years)

Years Active: 2006-2020
Publications (10 Years): 7

Top Topics

Risk Assessment

Programmable Logic

Manufacturing Processes

Loading Conditions

Top Venues

Microelectron. Reliab.

Publications

Irandokht Parviziomran, Shun Cao, Haeyong Yang, Seungbae Park, Daehan Won
Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology. CoRR (2020)
Shun Cao, Irandokht Parviziomran, Haeyong Yang, Seungbae Park, Daehan Won
Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression. CoRR (2020)
Yuling Niu, Jing Wang, Shuai Shao, Huayan Wang, Hohyung Lee, Seungbae Park
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. Microelectron. Reliab. 87 (2018)
Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, Seungbae Park
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors 17 (2) (2017)
Jing Wang, Ruiyang Liu, Dapeng Liu, Seungbae Park
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions. Microelectron. Reliab. 73 (2017)
Ah-Young Park, Satish C. Chaparala, Seungbae Park
Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface. Microelectron. Reliab. 66 (2016)
Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectron. Reliab. 65 (2016)
Tung T. Nguyen, Seungbae Park
Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling. Microelectron. Reliab. 51 (8) (2011)
Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading. Microelectron. Reliab. 51 (3) (2011)
Da Yu, Jae B. Kwak, Seungbae Park, John Lee
Dynamic responses of PCB under product-level free drop impact. Microelectron. Reliab. 50 (7) (2010)
Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park
Effect of glue on reliability of flip chip BGA packages under thermal cycling. Microelectron. Reliab. 50 (7) (2010)
Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta
Failure analysis of contact probe pins for SnPb and Sn applications. Microelectron. Reliab. 48 (6) (2008)
Sangjun Lee, Seungbae Park
Improving Accessibility and Security for Mobile Phone Shopping. J. Comput. Inf. Syst. 46 (3) (2006)