Chin-Li Kao

Publication Activity (10 Years)

Years Active: 2006-2018
Publications (10 Years): 2

Top Topics

Surface Fitting

Manufacturing Processes

Top Venues

Microelectron. Reliab.

Publications

Chin-Li Kao, Tei-Chen Chen
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes. Microelectron. Reliab. 82 (2018)
Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectron. Reliab. 65 (2016)
Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. Microelectron. Reliab. 54 (11) (2014)
Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectron. Reliab. 50 (4) (2010)
Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47 (8) (2007)
Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao
Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectron. Reliab. 46 (7) (2006)
Yi-Shao Lai, Chin-Li Kao
Characteristics of current crowding in flip-chip solder bumps. Microelectron. Reliab. 46 (5-6) (2006)
Yi-Shao Lai, Chin-Li Kao
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectron. Reliab. 46 (8) (2006)