Yi-Shao Lai

Publication Activity (10 Years)

Years Active: 1993-2015
Publications (10 Years): 0

Top Topics

Film Restoration

Factors Affecting

Chemical Vapor Deposition

Power Electronics

Top Venues

Microelectron. Reliab.

Publications

Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai
Power electronics packaging. Microelectron. Reliab. 55 (12) (2015)
Ee-Hua Wong, Jarrod Cook, M. Dreno, Dao-Long Chen, Yi-Shao Lai
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption. Microelectron. Reliab. 55 (11) (2015)
Dao-Long Chen, Tei-Chen Chen, Ping-Feng Yang, Yi-Shao Lai
Thermal resistance of side by side multi-chip package: Thermal mode analysis. Microelectron. Reliab. 55 (5) (2015)
Wun-Kai Wang, Hua-Chiang Wen, Chun-Hu Cheng, Ching-Hua Hung, Wu-Ching Chou, Wei-Hung Yau, Ping-Feng Yang, Yi-Shao Lai
/ZnO films. Microelectron. Reliab. 54 (12) (2014)
Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. Microelectron. Reliab. 54 (11) (2014)
Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectron. Reliab. 53 (2) (2013)
C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai
Reliability of micro-interconnects in 3D IC packages. Microelectron. Reliab. 53 (1) (2013)
Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation. Microelectron. Reliab. 52 (3) (2012)
Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectron. Reliab. 52 (1) (2012)
Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectron. Reliab. 52 (11) (2012)
Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. Microelectron. Reliab. 52 (2) (2012)
Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao Lai
The performance and fracture mechanism of solder joints under mechanical reliability test. Microelectron. Reliab. 52 (7) (2012)
Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai
Reliability of high-power LED packaging and assembly. Microelectron. Reliab. 52 (5) (2012)
Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectron. Reliab. 51 (8) (2011)
Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. Robert Kao
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. Microelectron. Reliab. 51 (1) (2011)
Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. Microelectron. Reliab. 51 (12) (2011)
Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai
Characteristic of copper wire and transient analysis on wirebonding process. Microelectron. Reliab. 51 (1) (2011)
Michael Mayer, Yi-Shao Lai
Copper Wire Bonding. Microelectron. Reliab. 51 (1) (2011)
Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai
Fine pitch copper wire bonding in high volume production. Microelectron. Reliab. 51 (1) (2011)
Ming-Jhang Wu, Hua-Chiang Wen, Shyh-Chi Wu, Ping-Feng Yang, Yi-Shao Lai, Wen-Kuang Hsu, Wen-Fa Wu, Chang-Pin Chou
/Si films. Microelectron. Reliab. 51 (12) (2011)
M. Y. Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectron. Reliab. 51 (3) (2011)
Jiunn Chen, Yi-Shao Lai, Chueh-An Hsieh, Chia Yi Hu
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations. Microelectron. Reliab. 50 (4) (2010)
Bo-Ching He, Chun-Hu Cheng, Hua-Chiang Wen, Yi-Shao Lai, Ping-Feng Yang, Meng-Hung Lin, Wen-Fa Wu, Chang-Pin Chou
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate. Microelectron. Reliab. 50 (1) (2010)
Hao-Yuan Chang, Wen-Fung Pan, Meng-Kai Shih, Yi-Shao Lai
Geometric design for ultra-long needle probe card for digital light processing wafer testing. Microelectron. Reliab. 50 (4) (2010)
Bo-Ching He, Hua-Chiang Wen, Meng-Hung Lin, Yi-Shao Lai, Wen-Fa Wu, Chang-Pin Chou
-Si films. Microelectron. Reliab. 50 (6) (2010)
Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectron. Reliab. 50 (4) (2010)
Tong Yan Tee, Xuejun Fan, Yi-Shao Lai
Advances in Wafer Level Packaging (WLP). Microelectron. Reliab. 50 (4) (2010)
Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. Microelectron. Reliab. 49 (7) (2009)
Jiunn Chen, Yi-Shao Lai
Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases. Microelectron. Reliab. 49 (3) (2009)
S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. Microelectron. Reliab. 49 (3) (2009)
Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan
Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectron. Reliab. 49 (3) (2009)
Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu
Recent research advances in Pb-free solders. Microelectron. Reliab. 49 (3) (2009)
Chang-Lin Yeh, Yi-Shao Lai
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. Microelectron. Reliab. 48 (2) (2008)
Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
Finite element model verification for packaged printed circuit board by experimental modal analysis. Microelectron. Reliab. 48 (11-12) (2008)
Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh
Effects of different drop test conditions on board-level reliability of chip-scale packages. Microelectron. Reliab. 48 (2) (2008)
Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. Microelectron. Reliab. 48 (3) (2008)
Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectron. Reliab. 48 (5) (2008)
Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. Microelectron. Reliab. 48 (1) (2008)
Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47 (8) (2007)
Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh
Evaluation of solder joint strengths under ball impact test. Microelectron. Reliab. 47 (12) (2007)
Yi-Shao Lai, Tong Hong Wang
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47 (1) (2007)
Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen
Cyclic bending reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47 (1) (2007)
Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen
Empirical correlation between package-level ball impact test and board-level drop reliability. Microelectron. Reliab. 47 (7) (2007)
Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectron. Reliab. 47 (12) (2007)
Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectron. Reliab. 47 (8) (2007)
Chang-Lin Yeh, Yi-Shao Lai
Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectron. Reliab. 46 (2-4) (2006)
Yi-Shao Lai
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials. Microelectron. Reliab. 46 (5-6) (2006)
Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao
Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectron. Reliab. 46 (7) (2006)
Yi-Shao Lai, Chin-Li Kao
Characteristics of current crowding in flip-chip solder bumps. Microelectron. Reliab. 46 (5-6) (2006)
Yi-Shao Lai, Chin-Li Kao
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectron. Reliab. 46 (8) (2006)
Chang-Lin Yeh, Yi-Shao Lai
Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectron. Reliab. 46 (5-6) (2006)
Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46 (2-4) (2006)
Chang-Lin Yeh, Yi-Shao Lai
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectron. Reliab. 45 (2) (2005)
Yi-Shao Lai, Tong Hong Wang
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectron. Reliab. 45 (3-4) (2005)
Ray-Shyan Wu, Yi-Shao Lai
An Observation on Fractal Characteristics of Individual River Plan Forms. Fractals in the Natural and Applied Sciences (1993)