Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints.

Ming-Hwa R. Jen Lee-Cheng Liu Yi-Shao Lai

Published in: Microelectron. Reliab. (2009)

Keyphrases

electron microscopy
x ray
thin film
real world
neural network
information retrieval
objective function
object recognition
expert systems
evolutionary algorithm
multiresolution
information extraction