Ming-Hwa R. Jen

Publication Activity (10 Years)

Years Active: 2007-2009
Publications (10 Years): 0

Publications

Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. Microelectron. Reliab. 49 (7) (2009)
Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen
Cyclic bending reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47 (1) (2007)