Cyclic bending reliability of wafer-level chip-scale packages.

Yi-Shao Lai Tong Hong Wang Han-Hui Tsai Ming-Hwa R. Jen

Published in: Microelectron. Reliab. (2007)

Keyphrases

high speed
scale space
low cost
real time
image processing
image sequences
lower level
social networks
higher level
degrees of freedom
shape representation
high density
levels of abstraction
confidence levels