Tong Hong Wang

Publication Activity (10 Years)

Years Active: 2005-2013
Publications (10 Years): 0

Top Topics

Factors Affecting

Mobile Learning

Power Consumption

Top Venues

Microelectron. Reliab.

Publications

Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectron. Reliab. 53 (2) (2013)
Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectron. Reliab. 52 (11) (2012)
Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectron. Reliab. 51 (8) (2011)
Te-Hua Fang, Tong Hong Wang, Deng-Maw Lu, Wen-Chieh Lien
Structural characteristics of carbon nanostructures synthesized by ECR-CVD. Microelectron. J. 39 (12) (2008)
Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. Microelectron. Reliab. 48 (1) (2008)
Yi-Shao Lai, Tong Hong Wang
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47 (1) (2007)
Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen
Cyclic bending reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47 (1) (2007)
Yi-Shao Lai, Tong Hong Wang
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectron. Reliab. 45 (3-4) (2005)