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Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions.
Tong Hong Wang
Yi-Shao Lai
Yu-Cheng Lin
Published in:
Microelectron. Reliab. (2008)
Keyphrases
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solder ball connect
higher level
sufficient conditions
power consumption
high density
levels of abstraction
ibm power processor
low cost
infrared
high speed
statistical tests
electricity markets
multithreading
vlsi implementation