Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly.
Yi-Shao LaiTong Hong WangPublished in: Microelectron. Reliab. (2005)
Keyphrases
- reliability assessment
- functional verification
- bp neural network model
- printed circuit boards
- power system
- high speed
- model checking
- low cost
- formal verification
- face verification
- analog vlsi
- vlsi implementation
- single chip
- programmable logic
- formal methods
- evolutionary algorithm
- assembly line
- evolvable hardware
- data sets
- visually guided
- verification method
- software defect
- manufacturing process
- asynchronous circuits
- power dissipation
- signature verification
- circuit design
- high density
- low power
- neural network model
- fault diagnosis
- neural network