Login / Signup
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA.
Tong Hong Wang
Sara N. Paisner
Chang-Chi Lee
Susan Chen
Yi-Shao Lai
Published in:
Microelectron. Reliab. (2011)
Keyphrases
</>
surface roughness
heat transfer
thermal conductivity
semiconductor devices
manufacturing process
high density