Chang-Chi Lee

Publication Activity (10 Years)

Years Active: 2011-2020
Publications (10 Years): 4

Top Topics

Curvature Estimation

Back Propagation Neural Network

Image Indexing And Retrieval

Structural Design

Top Venues

Microelectron. Reliab.

IEEE Trans. Circuits Syst. I Regul. Pap.

Publications

Cadmus C. A. Yuan, Chang-Chi Lee
Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package. IEEE Access 8 (2020)
Chang-Chi Lee, Hou-Ming Chen, Chi-Chang Lu, Bo-Yi Lee, Hsien-Chi Huang, He-Sheng Fu, Yong-Xin Lin
A High-Precision Bandgap Reference With a V-Curve Correction Circuit. IEEE Access 8 (2020)
Chang-Chi Lee, Yu-Sung Liu, Chun-Hsiang Tseng, Jeng-Yue Chen, Fuh-Shyang Juang, Yung-Ying Chang, Hung-Chih Hsu
Pesticide Residue Testing System for Fruits and Vegetables by Color Identification Technology. ICCE-TW (2019)
Hou-Ming Chen, Chang-Chi Lee, Shih-Han Jheng, Wei-Chih Chen, Bo-Yi Lee
A Sub-1 ppm/°C Precision Bandgap Reference With Adjusted-Temperature-Curvature Compensation. IEEE Trans. Circuits Syst. I Regul. Pap. (6) (2017)
Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectron. Reliab. 53 (2) (2013)
Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectron. Reliab. 52 (11) (2012)
Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectron. Reliab. 51 (8) (2011)