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Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package.
Cadmus C. A. Yuan
Chang-Chi Lee
Published in:
IEEE Access (2020)
Keyphrases
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artificial neural networks
low cost
back propagation
database
failure rate
data sets
genetic algorithm
evolutionary algorithm
high speed
software package
real time
high density
vlsi implementation
confidence levels