M. Y. Tsai

Publication Activity (10 Years)

Years Active: 2006-2016
Publications (10 Years): 4

Top Topics

Mechanical Design

Cutting Stock Problems

Top Venues

Microelectron. Reliab.

Comput. Electr. Eng.

IEEE Trans Autom. Sci. Eng.

Publications

M. Y. Tsai, S. Y. Chang, J. P. Hung, C. C. Wang
Investigation of milling cutting forces and cutting coefficient for aluminum 6060-T6. Comput. Electr. Eng. 51 (2016)
M. Y. Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectron. Reliab. 67 (2016)
M. Y. Tsai, P. S. Huang, C.-H. Lin, C. T. Wu, S. C. Hu
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. Microelectron. Reliab. 55 (12) (2015)
K. L. Ku, J. S. Liaw, M. Y. Tsai, T. S. Liu
Automatic Control System for Thermal Comfort Based on Predicted Mean Vote and Energy Saving. IEEE Trans Autom. Sci. Eng. 12 (1) (2015)
M. Y. Tsai, P. S. Huang, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, J. P. Lin
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages. Microelectron. Reliab. 54 (12) (2014)
M. Y. Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectron. Reliab. 51 (3) (2011)
M. Y. Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu
Thermal deformation measurements and predictions of MAP-BGA electronic packages. Microelectron. Reliab. 46 (2-4) (2006)