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Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.

M. Y. TsaiP. S. HuangC.-H. LinC. T. WuS. C. Hu
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • mechanical design
  • thin film
  • real world
  • data analysis
  • image analysis
  • quantitative analysis
  • databases
  • machine learning
  • wireless sensor networks
  • design process