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C. T. Wu
Publication Activity (10 Years)
Years Active: 1987-2024
Publications (10 Years): 10
Top Topics
Mechanical Design
High Power
Finite Element Method
Similar Patterns
Top Venues
CoRR
Microelectron. Reliab.
J. Intell. Manuf.
Adv. Eng. Softw.
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Publications
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Yuxi Xie
,
Shaofan Li
,
C. T. Wu
,
Zhipeng Lai
,
Miao Su
A novel hypergraph convolution network for wafer defect patterns identification based on an unbalanced dataset.
J. Intell. Manuf.
35 (2) (2024)
Haoyan Wei
,
C. T. Wu
,
Wei Hu
,
Tung-Huan Su
,
Hitoshi Oura
,
Masato Nishi
,
Tadashi Naito
,
Stan Chung
,
Leo Shen
LS-DYNA Machine Learning-based Multiscale Method for Nonlinear Modeling of Short Fiber-Reinforced Composites.
CoRR
(2023)
Haoyan Wei
,
Dandan Lyu
,
Wei Hu
,
C. T. Wu
RVE Analysis in LS-DYNA for High-fidelity Multiscale Material Modeling.
CoRR
(2022)
Bo Ren
,
C. T. Wu
,
Dandan Lyu
An h-adaptive meshfree-enriched finite element method based on convex approximations for the three-dimensional ductile crack propagation simulation.
Comput. Aided Geom. Des.
76 (2020)
Zeliang Liu
,
Haoyan Wei
,
Tianyu Huang
,
C. T. Wu
Intelligent multiscale simulation based on process-guided composite database.
CoRR
(2020)
Zeliang Liu
,
C. T. Wu
Exploring the 3D architectures of deep material network in data-driven multiscale mechanics.
CoRR
(2019)
Zeliang Liu
,
C. T. Wu
,
M. Koishi
A Deep Material Network for Multiscale Topology Learning and Accelerated Nonlinear Modeling of Heterogeneous Materials.
CoRR
(2018)
C. T. Wu
,
Ninshu Ma
,
Yong Guo
,
Wei Hu
,
Kenji Takada
,
Hideyuki Okada
,
Kei Saito
A dynamic ductile failure analysis of shell structures using a nonlocal XFEM method with experimental validation.
Adv. Eng. Softw.
123 (2018)
M. Y. Tsai
,
C. H. Lin
,
K. F. Chuang
,
Y. H. Chang
,
C. T. Wu
,
S. C. Hu
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications.
Microelectron. Reliab.
67 (2016)
M. Y. Tsai
,
P. S. Huang
,
C.-H. Lin
,
C. T. Wu
,
S. C. Hu
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.
Microelectron. Reliab.
55 (12) (2015)
C. T. Wu
Building Web Applications Using Java 2 Enterprise Edition.
TOOLS (39)
(2001)
C. T. Wu
Towards fully-computerized database maintenance for non-traditional appliances.
FJCC
(1987)