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Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications.

M. Y. TsaiC. H. LinK. F. ChuangY. H. ChangC. T. WuS. C. Hu
Published in: Microelectron. Reliab. (2016)
Keyphrases
  • high power
  • high density
  • thin film
  • neural network
  • support vector
  • artificial neural networks
  • low power
  • failure rate