Thermal deformation measurements and predictions of MAP-BGA electronic packages.

M. Y. Tsai W. C. Chiang T. M. Liu G. H. Hsu

Published in: Microelectron. Reliab. (2006)

Keyphrases

solder ball connect
infrared
maximum a posteriori
deformable objects
measurement noise
neural network
image registration
finite element analysis
finite element method
stress response