P. C. Lin

Publication Activity (10 Years)

Years Active: 2002-2014
Publications (10 Years): 0

Top Topics

Three Dimensional

Solder Ball Connect

Top Venues

Microelectron. Reliab.

Publications

M. Y. Tsai, P. S. Huang, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, J. P. Lin
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages. Microelectron. Reliab. 54 (12) (2014)
Jau-Chuan Ke, Yunn-Kuang Chu, Y.-T. Chung, P. C. Lin
. Qual. Reliab. Eng. Int. 25 (4) (2009)
Wen Lea Pearn, P. C. Lin
with critical values. Comput. Ind. Eng. 47 (4) (2004)
P. C. Lin, Wen Lea Pearn
Testing process capability for one-sided specification limit with application to the voltage level translator. Microelectron. Reliab. 42 (12) (2002)