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Tei-Chen Chen
Publication Activity (10 Years)
Years Active: 2003-2018
Publications (10 Years): 2
Top Topics
Surface Fitting
Analog Vlsi
Scale Invariant
Low Energy Electron
Top Venues
Microelectron. Reliab.
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Publications
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Chin-Li Kao
,
Tei-Chen Chen
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes.
Microelectron. Reliab.
82 (2018)
Dao-Long Chen
,
Tei-Chen Chen
,
Ping-Feng Yang
,
Yi-Shao Lai
Thermal resistance of side by side multi-chip package: Thermal mode analysis.
Microelectron. Reliab.
55 (5) (2015)
Chin-Li Kao
,
Tei-Chen Chen
,
Yi-Shao Lai
,
Ying-Ta Chiu
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.
Microelectron. Reliab.
54 (11) (2014)
Vladimir G. Romanov
,
Cheng-I Weng
,
Tei-Chen Chen
An inverse problem for a layered elastic plate.
Appl. Math. Comput.
137 (2-3) (2003)