Ying-Ta Chiu

Publication Activity (10 Years)

Years Active: 2007-2014
Publications (10 Years): 0

Top Topics

Top Venues

Microelectron. Reliab.

Publications

Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. Microelectron. Reliab. 54 (11) (2014)
Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectron. Reliab. 52 (1) (2012)
Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan
Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectron. Reliab. 49 (3) (2009)
Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47 (8) (2007)