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Alloying modification of Sn-Ag-Cu solders by manganese and titanium.

Li-Wei LinJenn-Ming SongYi-Shao LaiYing-Ta ChiuNing-Cheng LeeJun-Yen Uan
Published in: Microelectron. Reliab. (2009)
Keyphrases
  • mechanical properties
  • electron microscopy
  • finite element model
  • database
  • neural network
  • computer graphics
  • operating conditions