Kuo-Ming Chen

Publication Activity (10 Years)

Years Active: 2003-2019
Publications (10 Years): 4

Top Topics

Energy Consumption

Automatic Diagnosis

Top Venues

IEEE Trans. Veh. Technol.

Publications

Kuo-Ming Chen, Tsung-Hui Chang, Ta-Sung Lee
Lifetime Maximization for Uplink Transmission in UAV-Enabled Wireless Networks. WCNC (2019)
Kuo-Ming Chen, Tsung-Hui Chang, Kai-Cheng Wang, Ta-Sung Lee
Machine Learning Based Automatic Diagnosis in Mobile Communication Networks. IEEE Trans. Veh. Technol. 68 (10) (2019)
Kuo-Ming Chen, Yun-Han Pan, Ta-Sung Lee
Low-Complexity Beam Selection for Hybrid Precoded Multi-User mmWave Communications. ICSPCC (2018)
Chun-Wei Li, Kuo-Ming Chen, Po-Chun Fu, Wei-Ning Chen, Che Lin
Energy-Efficient Deterministic Adaptive Beamforming Algorithms for Distributed Sensor/Relay Networks. CoRR (2015)
Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology. Microelectron. Reliab. 51 (4) (2011)
Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47 (8) (2007)
Lih-Chyau Wuu, Tzong-Jye Liu, Kuo-Ming Chen
A longest prefix first search tree for IP lookup. Comput. Networks 51 (12) (2007)
Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectron. Reliab. 46 (12) (2006)
Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang
Thermal resistance analysis and validation of flip chip PBGA packages. Microelectron. Reliab. 46 (2-4) (2006)
Lih-Chyau Wuu, Kuo-Ming Chen, Tzong-Jye Liu
A longest prefix first search tree for IP lookup. ICC (2005)
Kuo-Ming Chen, Yuan-Tsung Chen, Ming-Shi Wang
Reconstruction and Fusion of Multi-modality Spinal Images. CISST (2004)
Kuo-Ming Chen, Kuo-Ning Chiang
Impact of probing procedure on flip chip reliability. Microelectron. Reliab. 43 (1) (2003)