Kuo-Ning Chiang

Publication Activity (10 Years)

Years Active: 2003-2012
Publications (10 Years): 0

Top Topics

Light Emitting Diodes

Image Processing

Top Venues

Microelectron. Reliab.

Publications

Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang
Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectron. Reliab. 52 (5) (2012)
Tsung-Lin Chou, Shin-Yueh Yang, Chung-Jung Wu, Cheng-Nan Han, Kuo-Ning Chiang
thin film and III-V material. Microelectron. Reliab. 51 (9-11) (2011)
Tsung-Lin Chou, Chien-Fu Huang, Cheng-Nan Han, Shin-Yueh Yang, Kuo-Ning Chiang
Fabrication process simulation and reliability improvement of high-brightness LEDs. Microelectron. Reliab. 49 (9-11) (2009)
Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. Microelectron. Reliab. 48 (8-9) (2008)
Hsiao-Tung Ku, Kuo-Ning Chiang
The mechanical stress resistance capability of stress buffer structures in analog devices. Microelectron. Reliab. 48 (5) (2008)
Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang
Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis. Microelectron. Reliab. 47 (9-11) (2007)
Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. 47 (2-3) (2007)
Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectron. Reliab. 46 (12) (2006)
Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron. Reliab. 46 (2-4) (2006)
Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang
Thermal resistance analysis and validation of flip chip PBGA packages. Microelectron. Reliab. 46 (2-4) (2006)
Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectron. Reliab. 44 (4) (2004)
Kuo-Ming Chen, Kuo-Ning Chiang
Impact of probing procedure on flip chip reliability. Microelectron. Reliab. 43 (1) (2003)