Chang-Chun Lee

Publication Activity (10 Years)

Years Active: 2007-2023
Publications (10 Years): 5

Top Topics

Mechanical Properties

Field Effect Transistors

Top Venues

Microelectron. Reliab.

Publications

Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee
Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation. IRPS (2023)
Cheng Zhan, Licheng Zhang, Xin Zhao, Chang-Chun Lee, Shujiao Huang
Neural Architecture Search for Inversion. CoRR (2022)
Chang-Chun Lee, Chuan-Hsi Liu, Dian-Yong Li, Chia-Ping Hsieh
channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays. Microelectron. Reliab. 83 (2018)
Chang-Chun Lee, Chien-Chao Huang
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology. Microelectron. Reliab. 55 (11) (2015)
Tao-Chih Chang, Chang-Chun Lee, Chia-Ping Hsieh, Sheng-Che Hung, Ren-Shin Cheng
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. Microelectron. Reliab. 55 (12) (2015)
Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang
Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectron. Reliab. 52 (5) (2012)
Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. 47 (2-3) (2007)