Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation.
Chi-Wei WangChe-Pei ChangChang-Chun LeePublished in: IRPS (2023)
Keyphrases
- process oriented
- multiscale
- computer supported
- ims learning design
- estimation algorithm
- high speed
- monte carlo simulation
- high density
- neural network
- optic flow
- simulation environment
- optical flow estimation
- goal oriented
- estimation accuracy
- scale space
- higher level
- business processes
- wavelet transform
- image processing
- computer vision