Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology.
Tao-Chih ChangChang-Chun LeeChia-Ping HsiehSheng-Che HungRen-Shin ChengPublished in: Microelectron. Reliab. (2015)
Keyphrases
- silicon on insulator
- high density
- physical characteristics
- high speed
- metal oxide semiconductor
- ibm power processor
- chip design
- power grid
- power distribution
- field effect transistors
- power consumption
- cost effective
- electronic devices
- electrical power
- power transmission
- printed circuit boards
- electrical energy
- memory subsystem
- low cost
- ultra low power
- data hiding
- data processing
- case study
- multithreading
- input device
- integrated circuit
- design process
- computer systems