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Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.

Chang-Chun LeeChien-Chen LeeHsiao-Tung KuShu-Ming ChangKuo-Ning Chiang
Published in: Microelectron. Reliab. (2007)
Keyphrases
  • layout design
  • response surface methodology
  • genetic programming
  • neural network
  • prediction model