Hsiao-Tung Ku

Publication Activity (10 Years)

Years Active: 2007-2008
Publications (10 Years): 0

Publications

Hsiao-Tung Ku, Kuo-Ning Chiang
The mechanical stress resistance capability of stress buffer structures in analog devices. Microelectron. Reliab. 48 (5) (2008)
Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. 47 (2-3) (2007)