Chia-Tai Kuo

Publication Activity (10 Years)

Years Active: 2004-2006
Publications (10 Years): 0

Publications

Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron. Reliab. 46 (2-4) (2006)
Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectron. Reliab. 44 (4) (2004)