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Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.

Chih-Tang PengChia-Tai KuoKuo-Ning ChiangTerry KuKenny Chang
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • behavior analysis
  • mechanical properties
  • experimental data
  • high speed
  • printed circuit boards
  • feature extraction
  • behavior patterns
  • image sequences
  • anomaly detection
  • surveillance system
  • drug discovery