Chih-Tang Peng

Publication Activity (10 Years)

Years Active: 2006-2006
Publications (10 Years): 0

Publications

Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron. Reliab. 46 (2-4) (2006)