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Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.

Kuo-Ming ChenJ. D. WuKuo-Ning Chiang
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • neural network
  • stochastic processes
  • information retrieval
  • feature selection
  • data structure
  • mechanical properties