J. D. Wu

Publication Activity (10 Years)

Years Active: 2001-2006
Publications (10 Years): 0

Publications

Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectron. Reliab. 46 (12) (2006)
J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. Microelectron. Reliab. 46 (1) (2006)
Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectron. Reliab. 43 (6) (2003)
J. D. Wu, C. Y. Huang, C. C. Liao
Fracture strength characterization and failure analysis of silicon dies. Microelectron. Reliab. 43 (2) (2003)
J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung
Board level reliability of a stacked CSP subjected to cyclic bending. Microelectron. Reliab. 42 (3) (2002)
S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu
Board level reliability of PBGA using flex substrate. Microelectron. Reliab. 41 (5) (2001)