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A study in flip-chip UBM/bump reliability with effects of SnPb solder composition.

J. D. WuP. J. ZhengC. W. LeeS. C. HungJ. J. Lee
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • high density
  • case study
  • experimental study
  • genetic algorithm
  • high speed
  • infrared
  • theoretical framework