S. C. Hung

Publication Activity (10 Years)

Years Active: 2001-2006
Publications (10 Years): 0

Publications

J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. Microelectron. Reliab. 46 (1) (2006)
Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectron. Reliab. 43 (6) (2003)
J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung
Board level reliability of a stacked CSP subjected to cyclic bending. Microelectron. Reliab. 42 (3) (2002)
S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu
Board level reliability of PBGA using flex substrate. Microelectron. Reliab. 41 (5) (2001)