Wen-Kun Yang

Publication Activity (10 Years)

Years Active: 2008-2008
Publications (10 Years): 0

Publications

Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. Microelectron. Reliab. 48 (8-9) (2008)